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Vishay VS-HOT200C080: What to Validate Before a 48 V Inverter Design-In


The short answer: Mouser announced on October 7, 2026 that it is shipping Vishay's VS-HOT200C080, an 80 V, 200 A-class half-bridge MOSFET module aimed at 48 V traction inverters and mild-hybrid recuperation systems. Power-electronics engineers, commodity managers, and contract manufacturers evaluating the part should not treat it as a drop-in bill of materials (BOM) substitution. Confirm the exact ordering code, obtain the current datasheet and qualification package, then validate the gate drive, thermal interface, busbar geometry, sensing chain, protection limits, and written regional available-to-promise (ATP) before releasing a quotation or production build.

Conceptual bright laboratory integration of a generic 48 V half-bridge power module, busbars and heatsink
A conceptual 48 V inverter integration scene. It is not a photograph of the Vishay part and should not be used for mechanical design.

What changed on October 7, 2026

The new event is a channel availability announcement, not a product-change notice. Mouser's October 7 newsroom release says it is now shipping the VS-HOT200C080 and positions the module for light electric vehicle traction inverters and belt-start generator or recuperation systems in mild-hybrid vehicles. The announcement gives buyers a clear commercial trigger to request samples and formal quotations.

It does not prove global availability, allocation-free supply, a production-life commitment, or stock for a specific destination. The distributor's live product page could not be independently read without an anti-automation challenge during this review, so transient inventory, pricing, and lead-time figures are deliberately excluded from this article. Ask the authorized channel to put ATP, date code, lot traceability, export eligibility, packaging, and factory lead time in writing for the target ship-to country.

The engineering baseline comes from Vishay, not the channel headline. Vishay's official product page identifies the exact MPN as a FlatPAK HC0 transfer-mold half-bridge module with current sensing, temperature sensing, and an electrically isolated exposed direct-bonded copper (DBC) substrate. The manufacturer's datasheet, revision dated August 7, 2026, supplies the electrical, thermal, mechanical, pinout, and qualification details required for a real design review.

The specifications that matter first

VS-HOT200C080 is an 80 V half-bridge power MOSFET module. The datasheet rates continuous drain current at 195 A with a case temperature of 80 °C and lists 243 A at 25 °C and 150 A at 118 °C. Those are condition-bound device ratings, not a promise that an assembled inverter can carry the same current under every coolant temperature, duty cycle, switching frequency, altitude, or enclosure condition.

The datasheet separates chip-level and module-level resistance. For Q1 at 25 °C, the typical chip-level RDS(on) is 0.45 mΩ at 200 A and 10 V gate drive, while the typical module-level value is 1.79 mΩ and the maximum is 2.35 mΩ. Q2 has the same listed module-level values even though its chip-level path is different. Loss calculations should therefore use the correct measurement boundary and temperature, not the smallest number on the first page.

The module integrates more than two switches. The published pin table includes high-side and low-side gates and sense returns, DC+, GND, phase output, a shunt-resistor sense pair, and two thermistor terminals. The internal shunt is specified at 0.3 mΩ with ±1% tolerance, while the internal negative temperature coefficient (NTC) thermistor is 10 kΩ at 25 °C with a B25/100 value of 3625 K ±1%. These functions can reduce external component count, but only if the controller's gain, offset, isolation, filtering, diagnostics, and fault thresholds are designed around the documented behavior.

Conceptual exploded thermal stack of a generic transfer-mold power module, isolated substrate, interface layer and heatsink
Conceptual thermal-stack illustration. Use Vishay's dimension drawing and application-specific thermal analysis for the actual design.

Thermal and mechanical validation comes before current claims

The FlatPAK HC0 outline is approximately 30.0 mm by 22.8 mm in the manufacturer's dimension drawing, but package width alone is not a mechanical release. The exposed DBC surface, terminal locations, two mounting holes, busbar clearance, creepage, flatness, assembly stack-up, and service access all need to be checked against the production enclosure and printed circuit board assembly (PCBA).

Vishay lists a maximum junction-to-case thermal resistance of 0.77 °C/W for the MOSFET path. The 0.15 °C/W typical case-to-heatsink figure is tied to a flat, greased surface using a stated 4.0 W/mK grease at 70 µm thickness. Changing the thermal-interface material, bond-line thickness, clamping method, surface finish, or flatness changes the thermal path. Treat the datasheet setup as a test condition, not a finished cooling design.

The module also specifies an M3 mounting screw and 0.7 N·m mounting torque. Manufacturing engineering should define a controlled tightening sequence, tool calibration, interface-material dispense or pad placement, inspection criteria, and rework rules. A prototype that survives a bench run is not enough; confirm junction-temperature margin through worst-case steady-state and transient profiles, then correlate the model with instrumented hardware.

Gate drive, switching energy, and protection need application data

The typical total gate charge is 130 nC at 48 V drain-source voltage, 80 A drain current, and a 0 V to 10 V gate swing. Vishay's switching-energy table uses different conditions: 52 V, 250 A, and a 0 V to 13 V gate drive with stated gate resistances. At 25 °C, the table gives typical turn-on energy of 0.42 mJ and turn-off energy of 2.52 mJ, with maximum values of 0.7 mJ and 4.0 mJ under those specific test conditions. These numbers are useful anchors, not substitutes for a double-pulse test at the intended gate driver, bus layout, current, temperature, and switching frequency.

Review dead time, common-source inductance, gate-loop impedance, Miller behavior, overvoltage margin, reverse-recovery stress, current-sense bandwidth, and desaturation or overcurrent response as a system. The datasheet lists 10 nH typical package stray inductance, but the complete commutation loop includes the busbar, DC-link capacitors, fasteners, and fixture. Overshoot seen on the assembled inverter can therefore differ materially from a datasheet plot.

The 80 V rating also requires a deliberate surge budget in a nominal 48 V platform. Load dump, regenerative events, wiring inductance, braking transitions, and controller faults can push the switch closer to its limit. The engineering review should define the maximum DC-link voltage, clamp strategy, fault duration, repetitive avalanche policy, measurement bandwidth, and acceptance margin before the module reaches a production BOM.

Bright conceptual power-electronics validation bench with generic half-bridge module, oscilloscope, current sensor and temperature probe
A representative validation bench: double-pulse, thermal, sensing, and protection checks should use the intended driver and power-loop hardware.

AQG324 and PPAP language still requires document review

Vishay states that the module is qualified according to Automotive Qualification Guideline 324 (AQG324) and is capable of a Production Part Approval Process (PPAP) submission. Those phrases are meaningful, but they do not mean that a customer's PPAP is already approved or that every requested document is available at the desired submission level. Ask for the qualification report, applicable PPAP package, material declarations, change-notification terms, traceability format, production site information, and any application restrictions relevant to the program.

Procurement should keep the complete ordering code VS-HOT200C080 on the request for quotation (RFQ), purchase order, approved vendor list (AVL), inspection plan, and incoming record. Do not merge it with a family name, a shortened “HOT200” label, or a mechanically similar module. If another part is proposed, describe it only as a candidate alternative that requires validation until the supplier and engineering team have confirmed electrical ratings, pinout, package geometry, thermal interface, sensing functions, qualification evidence, and system performance.

For supply assurance, request a destination-specific updated quotation rather than copying a web snapshot into the enterprise resource planning (ERP) record. The quote should identify currency, price breaks, minimum order quantity, packaging, ship-from location, current ATP, factory lead time, date-code limits, non-cancellable, non-returnable (NCNR) terms, and the validity window. That preserves a clean boundary between a distributor-page observation and a purchase commitment.

Keep facts, engineering judgment, and recommendations separate

Layer What this article says Boundary
Verified fact Vishay documents an 80 V FlatPAK HC0 half bridge, 195 A at 80 °C case temperature, integrated current and temperature sensing, isolated DBC, AQG324-guideline qualification, and PPAP capability. Values remain subject to their datasheet test conditions and revision.
Verified event Mouser announced on October 7, 2026 that it is shipping the exact MPN. A channel announcement is not global ATP or a supply guarantee.
Engineering judgment The module can simplify a 48 V power stage, but the integrated package moves several risks into thermal, busbar, gate-drive, sensing, and assembly validation. This is an application assessment, not a manufacturer guarantee.
Recommended action Run a controlled design-in review and obtain a written, destination-specific quotation before BOM release. The final decision belongs to the customer's engineering, quality, and procurement owners.

A practical design-in action plan

  1. Freeze the identity. Use VS-HOT200C080 exactly, archive the August 7, 2026 datasheet revision, and record the requested qualification documents.
  2. Close the mechanical stack. Check the official footprint and dimension drawing against the heatsink, busbar, DC-link capacitor, fasteners, insulation, PCBA, and service envelope.
  3. Prove the electrical margins. Run switching, surge, short-circuit or overcurrent, current-sense, NTC, electromagnetic interference (EMI), and thermal tests across the intended voltage, current, coolant, ambient, and duty-cycle range.
  4. Qualify the manufacturing process. Define interface-material control, torque, flatness, inspection, traceability, and rework requirements before pilot production.
  5. Convert a web signal into a purchase commitment. Obtain written regional ATP and an updated quotation tied to quantity, packaging, date code, ship-to country, and validity period.

If you are evaluating VS-HOT200C080 for a new inverter or a redesign, send the exact BOM line, target quantity, destination, timing, and the PCBA or power-stage engineering constraints through our electronic components sourcing team. We can coordinate an updated quotation and a focused engineering review without treating any candidate alternative as approved before validation.

Frequently asked questions

Is VS-HOT200C080 a drop-in replacement for a discrete MOSFET half bridge?

No. It is an integrated module with its own pinout, DBC thermal interface, mounting requirements, current shunt, NTC, switching behavior, and qualification boundary. Any replacement or redesign is a candidate that requires electrical, thermal, mechanical, firmware, protection, and manufacturing validation.

Does the 195 A rating guarantee 195 A in my inverter?

No. The 195 A value is specified at an 80 °C case temperature under datasheet conditions. Allowable system current depends on junction-temperature margin, cooling, interface material, duty cycle, switching losses, busbar resistance, ambient conditions, and fault requirements.

Does AQG324 qualification mean PPAP is already approved?

No. Vishay states that the module is qualified according to AQG324 guidelines and is PPAP capable. The customer still needs to request, review, and approve the relevant qualification evidence and program-specific PPAP submission.

Can distributor inventory be treated as global available-to-promise?

No. A web inventory figure is a time- and region-specific channel snapshot. Use a written quotation to confirm destination-specific ATP, ship-from location, allocation status, packaging, date code, export eligibility, factory lead time, and validity.

What should be included in a VS-HOT200C080 design-in RFQ?

Include the exact MPN, annual and immediate quantities, ship-to country, target dates, packaging and date-code limits, required AQG324 and PPAP documents, traceability needs, prototype timing, and the electrical, thermal, and mechanical questions that must be closed before BOM release.

Sources

  1. Vishay: VS-HOT200C080 official product page (accessed October 10, 2026).
  2. Vishay: VS-HOT200C080 datasheet, document 97360, revision August 7, 2026 (accessed October 10, 2026).
  3. Mouser: VS-HOT200C080 product information page (accessed October 10, 2026).
  4. Mouser Newsroom: “New at Mouser: Vishay VS-HOT200C080 200A 80V Power MOSFET Module”, October 7, 2026 (accessed October 10, 2026).

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