H9AG8GDMNB is a memory-device marking associated with SK hynix. The short marking alone is not enough to confirm the exact storage capacity, RAM capacity, speed grade, package or orderable part number. Those details depend on the complete suffix and the documentation for the exact device.
If you are identifying a chip from a phone, tablet, embedded board or repair part, record every character printed on the device and packaging label. Send the full marking, board model, quantity and clear photographs with your enquiry. Do not choose a replacement from the shared H9AG8GDMNB characters alone.
Is H9AG8GDMNB RAM or storage?
SK hynix publishes an eMCP product family that combines eMMC 5.1 storage and LPDDR4X working memory in one package. This explains why searches for H9AG8GDMNB may refer to both storage and RAM.
That family-level information does not prove the capacities or speed of a device identified only as H9AG8GDMNB. SK hynix shows several density configurations across its eMCP range. Use the complete orderable number and its applicable datasheet to determine the exact configuration.
How many GB is H9AG8GDMNB?
A reliable GB value cannot be determined from the shortened H9AG8GDMNB marking alone. Capacity listings found on marketplaces may describe one suffixed variant and should not be transferred to every part sharing the same base characters.
To confirm the capacity, use at least one of these sources:
- the complete part number, including every suffix character;
- the manufacturer datasheet or product record for that complete number;
- the original device BOM, service documentation or approved vendor list;
- a packaging label that ties the complete number to the production lot; or
- device-level diagnostic information, checked against the board design.
Why the suffix matters
Search results may show longer strings such as H9AG8GDMNBX113. Treat that suffix as part of the identity, not as optional text. A suffix can distinguish density, organization, speed, package, revision or other orderable characteristics. Do not assume that two strings are interchangeable because their first characters match.
When a top-side marking is abbreviated, ask for the packaging label or original BOM line. If those are unavailable, identify the host device and PCB revision and have an engineer verify the candidate part before purchase.
Specifications to verify before sourcing
| Check | What to confirm | Why it matters |
|---|---|---|
| Exact identity | Manufacturer, complete part number, suffix and top marking | Prevents a similar code from being quoted as the requested device |
| Memory configuration | eMMC density and LPDDR density for the exact orderable part | Answers the storage and RAM capacity questions |
| Interface | Applicable eMMC and LPDDR generation, bus configuration and supported speed | Must match the processor and board design |
| Electrical limits | Supply rails, I/O levels and operating conditions | Incorrect values can prevent operation or damage hardware |
| Package | Dimensions, ball count, ball map and PCB footprint | A visually similar package may have a different pinout |
| Qualification | Temperature grade, lifecycle status and required compliance records | Needed for production and quality approval |
Can H9AG8GDMNB be replaced by a similar memory device?
A matching capacity or package outline is not enough to establish a drop-in replacement. The processor must support the memory organization and interface, the ball map must match the PCB, and boot firmware may depend on the original configuration. Compare the exact datasheets and obtain engineering approval before substitution.
For a repair, confirm whether the device stores board-specific data and whether programming is required. For production, qualify samples under the same assembly, boot, stress and functional tests used for the original part.
What to include in an H9AG8GDMNB RFQ
- Complete part number and manufacturer.
- Clear top-side and packaging-label photographs.
- Required quantity and target delivery date.
- Device or PCB model and revision, when relevant.
- Accepted date-code range, packaging and component condition.
- Required traceability, inspection and compliance documents.
- Whether alternatives may be proposed for engineering review.
Availability, price, lead time and documentation should be confirmed for the exact part and lot in the quotation. A web page or marketplace listing is not evidence of current stock.
Frequently asked questions
What are the H9AG8GDMNB specs?
The shortened marking does not establish a complete specification. SK hynix's relevant eMCP family combines eMMC 5.1 storage with LPDDR4X memory, but the exact capacities, speed and package must be verified from the full suffixed part number.
Is H9AG8GDMNB a 32 GB chip?
Do not assign 32 GB to every device with this base marking. Confirm the full suffix and the matching manufacturer documentation before recording a capacity.
Does H9AG8GDMNB include RAM?
The relevant SK hynix eMCP family combines storage and working memory in one package. The amount of each cannot be confirmed from the shortened marking alone.
Can H9AG8GDMNBX113 replace H9AG8GDMNB?
That cannot be established from the two strings alone. Verify the complete identity of the installed device, compare the applicable documentation and obtain engineering approval.
How can I request a quotation?
Submit the complete part number or BOM with quantity, photographs and delivery requirements. Informic can then confirm what information is available for the exact quoted part and lot.
